Aqua Plasma Boost® and AQ-2000BT: Excellent for Reducing Large Sized Samples of Oxidized Copper
Samco developed Aqua Plasma Boost® to enhance oxidized copper reduction using reducing gas and water vapor.
Application of Aqua Plasma® for Microbumps
Samco’s Aqua Plasma® improves microbump fabrication by enhancing photoresist and Cu hydrophilization, preventing oxidation, and enabling better plating solution penetration for fine patterns.