Samco’s UV Ozone Cleaners use a unique combination of ultraviolet irradiation, ozone, and stage heating to gently, yet effectively, remove organic materials from a variety of substrates, including silicon, glass, compound semiconductors (GaN, SiC, GaAs, and InP), sapphire, ceramics, and more. Today our product line includes compact benchtop and cassette type systems for both R&D and mass production customers.
UV-Ozone Cleaning System Lineup
Key Features & Benefits
- Superior process performance with stage heating and ozone generator
- Compact, space-saving tabletop cleaner option
- Up to 300 mm wafer processing
- Cassette-to-cassette system option for production use
- Low physical ion and charging damage
- Completely dry process
Applications
- Surface cleaning of silicon wafers, plastic packages
- III-V compound semiconductor wafers such as GaAs and InP before MOCVD and ALD process
- Lead frame and bond pad cleaning for device packaging
- Surface modification of polymer substrates
- Surface activation
- Wettability improvement of microfluidics channels
- Adhesion improvement for direct substrate bonding such as glass, PDMS, PMMA, COC and COP
- Surface oxidation (thin oxidized layer deposition)
- Organic contamination removal
- Photoresist ashing and stripping
- UV curing, outgassing and hardbaking of photoresist
- Photoresist descum
- Cleaning of AFM tips
- Surface cleaning of Quartz Crystal Micro-balance (QCM) sensors
- Cleaning of Surface Plasmon Resonance (SPR) chips
- UV crosslinking of polymers and photoresist