Atomic Layer Etching (ALE) is a technology that separates the adsorption and reaction steps in the etching process and repeats each step to control etching depth at the nano-level. ALE is gaining increasing attention as semiconductor devices become finer, emerging as a key process in the development of next-generation devices. ALE is expected to find applications in processes such as controlling GaN or AlGaN film thickness and maintaining surface smoothness through low-rate etching, as well as in p-GaN/AlGaN high selectivity ratio etching of GaN HEMT device. Samco offers two models of ICP etching systems for ALE, “RIE-400iP-ALE” and “RIE-800iP-ALE,” which are suitable for use across research and production stages.

ALE System Lineup

Atomic Layer Etching System RIE-800iP-ALE

Precision etching, atom by atom
⌀8″
Load Lock
ALE
none

Atomic Layer Etching System RIE-400iP-ALE

Precise depth control
⌀4″
Load Lock
ALE
none

Key Features & Benefits

  • Precise depth control
  • Robust, fast-switching gas input valve
  • New ICP Source “HSTC™: Hyper Symmetrical Tornado Coil
  • High flow exhaust
  • Endpoint monitoring

Applications

  • Recess etching for GaN HEMT
  • p-GaN/AlGaN high selectivity ratio etching
  • 2D materials etching
  • Photonic crystal etching
  • Low rate and low damage etching

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