Samco’s deposition systems enable the precise application of high-quality thin films with excellent film properties by introducing reactive gases onto substrate surfaces and initiating chemical reactions via plasma and/or thermal energy sources.
Our product line includes Cathode-Coupled Plasma Enhanced Chemical Vapor Deposition (PECVD) and Anode-Coupled PECVD systems. Cathode PECVD delivers high-speed, low-stress films up to 100 µm thick for challenging applications, while Anode PECVD minimizes ion impact to sensitive device layers. Deposition temperature as low as 70°C is possible without compromising film properties. Additionally, our Atomic Layer Deposition (ALD) systems offer angstrom-level thickness control and excellent conformality for high-aspect-ratio features. Configurations are available in open load, load lock, and cassette types to meet R&D and production needs worldwide.
Atomic layer deposition (ALD) is a thin-film growth technology that is capable of depositing pinhole-free and uniform insulator films for electronic devices (Power and RF). ALD offers exceptional conformality on high-aspect-ratio trench and via structures, thickness control at the angstrom level, and tunable film composition based on sequential, self-limiting reactions.
Anode PECVD Systems
Plasma Enhanced Chemical Vapor Deposition (PECVD) is a technology which forms a thin film by generating active radicals and ions on a target substrate by turning a reactive gas into a plasma state and causing chemical reactions on the target substrate to be deposited. It is used to deposit silicon nitride film (SiN) as a passivation film and silicon oxide film (SiO₂) as an interlayer insulating film in the manufacturing process of compound semiconductors and silicon semiconductors.
Cathode PECVD Systems
Samco’s unique Cathode PECVD systems utilize self-bias deposition techniques and TEOS to deposit SiO₂ films with low stress, ranging from thin films to extremely thick films (up to 100 µm). These systems, which can operate at low temperatures (80 ~ 400°C), offer high-speed deposition rates (>300 nm/min). The Liquid Source CVD® process developed by Samco employs proprietary liquid source materials, ensuring efficient and high-quality film growth at reduced temperatures.