⌀240 mm
Cassette Loading
none
Dual Cassettes
High ashing rates
The UV-300H is a high-performance, compact UV ozone cleaner designed for efficient organic removal. Featuring a convenient sliding drawer for substrate loading, it combines ultraviolet irradiation, high-concentration ozone, and stage heating to deliver gentle yet effective cleaning. This system supports a wide range of substrates, including silicon, glass, compound semiconductors (GaN, SiC, GaAs, InP), sapphire, and ceramics.
Key Features & Benefits
- Processing up to ø300 mm (ø12 inch）
- High ashing rates of 200 – 300 nm/min
- Heating stage accelerates the cleaning rates and realizes a broad process temperature range
- Gap adjustment between the stage and the quartz diffusion plate enables uniformity improvement over the substrate
- Compact, uses minimum cleanroom space
- Easy, operates at atmospheric pressure – no vacuum system required
- Soft, completely dry process will not cause electrical damage to substrates
- Drawer interlock guarantees system is inoperable when the drawer is open
- Built-in ozone catalyst unit for reducing ozone concentration in the exhaust to a safe level
Applications
- Surface cleaning of plastic packages and lead-frames
- Surface cleaning of compound semiconductor (GaN, SiC, GaAs, and InP)
- Surface modification (wettability and adhesion improvement)
- Surface oxidation (thin oxidized layer deposition)
- Photoresist ashing, stripping, and descuming
- Removal of organic contaminants
- UV curing
