⌀8″
Load Lock
LSCVD®
Carrier Tray Transfer
Load lock system up to ø200 mm (8")
The PD-200STL is a low-temperature (80 ~ 400°C), high-rate (>300 nm/min) plasma enhanced CVD system for R&D. Samco’s unique LSCVD system uses self-bias deposition techniques and a TEOS to deposit SiO₂ films with low stress, from thin films to extremely thick films (up to 100 µm).
With its sleek, compact design, the PD-200STL requires minimal cleanroom space. The reaction chamber is isolated from the environment by a loadlock chamber, which improves process repeatability.
Key Features & Benefits
- Processing up to ø200 mm (8″)
- Cathode coupled self-bias deposition techniques enables high-rate (>300 nm/min) deposition of low-stress films
- By low temperature deposition, films can be deposited on top of plastic surfaces
- Excellent step-coverage of high aspect ratio structures
- Control of refractive index by using germanium, phosphorus, and boron liquid precursor
- With its sleek, compact design, the PD-200STL requires minimal cleanroom space
Applications
- Deposition of protective films over plastic materials
- Deposition of the insulating film on via sidewalls for 3D LSIs
- Fabrication of optical waveguides (fiber core/cladding)
- Fabrication of masks for use in the production of micromachines
- Coverage of high aspect ratio structures such as MEMS devices
- Temperature compensation film and passivation film for SAW devices
