⌀8″
Cassette Loading
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Space-saving production system

The PD-2201LC is a cassette loading plasma-enhanced chemical vapor deposition (PECVD) system capable of depositing silicon-based films (silicon oxide, silicon nitride, silicon oxynitride and amorphous silicon).
This system offers all of the standard features for PECVD in a space-saving footprint. Films with superior thickness uniformity and stress control can be deposited over a 220 mm diameter area with excellent stability and repeatability. User-friendly touch screen interface for parameter control and recipe storage. This system is ideal for depositing thin films for mass production with excellent repeatability.

Key Features & Benefits

  • Processing up to ø220 mm (ø3″ x 5, ø4″ x 3, ø8″ x 1)
  • Superior uniformity and stress control
  • Excellent process stability and repeatability
  • Robust system with minimal running / maintenance cost
  • User-friendly touch screen interface for parameter control and recipe storage.
  • Sleek, space-saving design, requiring minimal cleanroom space
  • Dual-frequency (13.56 MHz + 400 kHz) PECVD for superior process control

Applications

  • SiH4-SiNx
  • SiH4-SiO2
  • Liquid precursor (SN-2) SiNx
  • TEOS-SiO2

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