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Smooth sidewalls
A 2 mm wide large-area etching process was performed using the Bosch Process, achieving:
- Etch depth: 300 μm
- Etch selectivity: 170 (over photoresist)
- Open area: <10%
The etched profile demonstrated smooth sidewalls and a flat bottom, free from grass-like structures or pits.
This process is ideal for fabricating piezoelectric MEMS sensors, such as those requiring large-area air gaps to release piezoelectric membranes or cantilevers.