Deep Si etching for pillar fabrication

Silicon DRIE technology enables precise pillar fabrication, making it a versatile solution for various applications such as microfluidics and optical MEMS devices.

Using the Bosch Process, this advanced etching method produces pillars with highly controlled dimensions and smooth sidewalls, minimizing scalloping for improved device performance.

• Pillar diameter: Ø10 µm
• Pillar height: 20 µm
• Sidewall scallop width: <100 nm

Photo courtesy of Princeton University.