Plasma Etching Systems: RIE, ICP-RIE, Si DRIE, and XeF2 Etcher Solutions
SAMCO Inc. > Etching Systems
Since our establishment in 1979, Samco has been at the forefront of dry etching innovation. Our comprehensive product line encompasses open-load, load-lock, and cassette type systems, catering to the diverse needs of both Research and Development (R&D) and production customers. Benefit from decades of expertise and advanced technology with Samco’s Reactive Ion Etching (RIE) Systems.
Multiple System Lineup for R&D and Production
Processes Up to 450 mm Wafers
Batch Processing With a Carrier
Small Footprint
Low Cost of Ownership
Experience the forefront of technology with Samco’s ICP Etching Systems, harnessing the power of cutting-edge inductively coupled plasma (ICP) technology. Our proprietary ICP plasma source, the “Tornado Coil”, sets the industry standard, providing a reliable and uniform etching process essential for next-generation devices.
Multiple System Lineup for R&D and Production
Processes Up to 450 mm Wafers
Batch Processing with a Carrier
Unique ICP Source for High Etch Uniformity
Multiple System Lineup for R&D and Production
High-conductance Vacuum Pump
Height-adjustable Electrode for High Etch Uniformity
High-Power Planar ICP Coil for High-rate SiC Etching
Unique ICP Coils for Excellent Etch Uniformity
Symmetrical Pumping for High Process Repeatability
Production-proven by HB LED manufacturers
Samco provides Silicon Deep Reactive Ion Etching (DRIE) systems for MEMS device fabrication and TSV processing. Samco was the first Japanese semiconductor process equipment manufacturer to offer DRIE systems using the Bosch Process.
The product lineup covers both R&D and production.
Multiple System Lineup for R&D and Production
High Density ICP Plasma Source for High-rate Si Deep Etch (Max. 55 µm/min)
High Speed Gas Switching (~ 0.1 sec)
Optional ICP Source for SiO2 Deep Etching
Samco offers XeF2 system for release etching of MEMS structures.
Compact Footprint
Plasma-free Process
Highly Selective Etching of Silicon
Complete Dry Process without Stiction Problems
Pulsing of the Gas Flow