⌀8″
Open Load
none
none
Compact power for up to 8-inches
The UV-2 is a versatile, compact benchtop UV ozone cleaning system designed for R&D and low-volume production. Leveraging a unique combination of ultraviolet radiation, ozone, and heat, it effectively removes organic materials from a wide range of substrates, including silicon, gallium arsenide (GaAs), sapphire, ceramics, and glass. Its advanced design ensures uniform cleaning, surface modification, and UV curing without the need for a vacuum system. Ideal for labs and production environments, the UV-2 offers precision cleaning in a space-saving package.
Key Features & Benefits
- Processes up to 8-inch wafers
Supports various sample shapes and sizes. - Compact design
Minimizes benchtop space requirements. - Heated sample stage
Accelerates cleaning and enables a broad process temperature range (ambient to 300°C). - Atmospheric pressure operation
No need for vacuum systems. - Dry, gentle process
Prevents electrical damage and preserves delicate substrates. - Drawer interlock system
Ensures safe operation by disabling the system when open. - Automated nitrogen purge system
Purges the chamber after each process run. - Built-in ozone catalyst
Reduces ozone emissions for safe operation. - Sealed process chamber
Prevents contamination from ambient air.
Applications
- Organic contamination removal
- Pre-cleaning wafers before deposition (e.g., GaAs prior to MBE, sapphire prior to HgCdTe)
- Photoresist descumming and polyimide stripping
- Surface modification for improved adhesion
- Final cleaning before wafer bonding
- UV curing
- Growth of thin, stable oxide films (e.g., Ge, Si)
- Cleaning precision tools like AFM tips
