Our advanced dry cleaning technology use gases to address challenges associated with wet chemical cleaning. The product line includes three types of systems, suitable for both R&D and production. Samco’s cleaning solutions ensure high-quality surface treatment for diverse applications.
- Plasma Ashing & Stripping ( Photoresist Removal)
- UV Ozone Ashing of Photoresist (low damage)
- Cleaning of Metals (Gold, Copper, & Silver) without Surface Oxidation
- Treatment & Bonding for Polymer Microfluidics
- Wettability Control
Aqua Plasma®
Samco’s Aqua Plasma® technology offers a versatile, water vapor-based approach to surface treatment for metals, polymers, and more. Aqua Plasma’s four key benefits include reducing oxidized electrode metals like copper, gold, and silver, achieving bonding without adhesives, enabling ashing of resin or carbon-based materials, and creating superhydrophilic surfaces for enhanced wettability. Ideal for microfluidics and device packaging, Aqua Plasma® supports fine surface modification needs without the drawbacks of conventional methods, ensuring compatibility with 3D structures, intricate microchannels, and delicate substrates.
Reduction
Surface Modification
Plasma Cleaning
Samco’s advanced plasma cleaning technology is designed to remove organic contaminants from various surfaces, offering a safer alternative to traditional wet chemical cleaning.
Ideal for both R&D and production, plasma cleaning can address a wide array of applications including the cleaning of plastic packages, lead-frames, LCD substrates, and multi-chip modules, as well as the precise removal of photoresist and organic residues.
Plasma Treatment
UV Ozone Cleaning
Samco’s UV-Ozone cleaning technology is a sophisticated process that leverages ultraviolet light and ozone to effectively clean and modify surfaces across diverse applications in device fabrication, material science, biochemistry, and molecular biology. This technology excels in removing organic contaminants and enhancing adhesion through surface activation and modification, leading to improved wettability. It is particularly valuable for cleaning lead frames and bond pads in device packaging, as well as for photoresist ashing, descumming, and UV curing of polymers. Furthermore, UV-Ozone cleaning ensures the cleanliness of critical components such as Atomic Force Microscopy tips, Quartz Crystal Micro-balance sensors, and Surface Plasmon Resonance chips, thereby optimizing performance in various scientific and industrial processes.