700°C High-Temperature PECVD System PD-101TC

Introduction to the 700°C High-Temperature PECVD System PD-101TC

Introduction Plasma-enhanced chemical vapor deposition (PECVD) systems were initially developed for low-temperature film deposition. However, recent diversification in research and development needs has led to a demand for systems capable of high-temperature film deposition. PECVD systems, a cornerstone of Samco, utilize silicon tetrahydride (SiH4) gas for silicon nitride (SiN) and silicon dioxide (SiO2) film deposition.…

What is Atomic Layer Deposition (ALD)?

Atomic Layer Deposition Tutorial: Introduction to ALD Atomic Layer Deposition (ALD) is a thin-film deposition technique that utilizes self-limiting surface chemical reactions to achieve precise layer-by-layer growth. By alternately introducing and exhausting two or more reactants into the reaction chamber, ALD enables excellent film thickness control, superior step coverage, and high conformality. As demand for…