Surface Treatment of Gold Using Aqua Plasma®

Technical reports

Discover the innovative Aqua Plasma® technology that transforms gold surface treatment in semiconductor manufacturing. This approach prevents oxidation and enhances the hydrophilicity of gold surfaces, making it versatile for various applications. Our study shows how Aqua Plasma® reduces gold oxides and improves bonding, ensuring optimal performance in critical processes. Explore the benefits of Aqua Plasma® and its potential to enhance your manufacturing practices. Contact our team for more information or to arrange a demonstration with our production-scale equipment!

Part 3 – Equipment Advances for the Bosch Process

Tutorials

Bosch Process Tutorial: Part 3. Equipment Advances for the Bosch Process In this article, we introduce the hardware employed to fully utilize the capabilities of the Bosch process for deep etching of silicon. The equipment used for the Bosch process has many significant features that differentiate it from typical ICP etching tools. Inductively Coupled Plasma…

AlGaN/GaN Etch Challenges for GaN Power Device Fabrication

Technical reports

As one of the most promising materials in compound semiconductors, Gallium Nitride (GaN) demonstrates high electron mobility and a wide bandgap, enabling numerous next-generation applications. GaN-based devices, from High Brightness LEDs in consumer electronics to emerging power devices, are central to advancements in displays, lighting, and high-performance power systems. The unique AlGaN/GaN heterointerface generates a…