Part 2 – What is the Bosch Process (Deep Reactive Ion Etching)?
Bosch Process Tutorial: Part 2. What is the Bosch Process? Figure 1. The Principles of the Bosch Process Deep reactive ion etching (DRIE) of silicon to create high aspect ratio microstructures is one of the key processes in the advanced MEMS field and through silicon via (TSV) applications. However, conventional plasma etching processes are designed…