Application of Aqua Plasma® for Microbumps
Samco’s Aqua Plasma® improves microbump fabrication by enhancing photoresist and Cu hydrophilization, preventing oxidation, and enabling better plating solution penetration for fine patterns.
Samco’s Aqua Plasma® improves microbump fabrication by enhancing photoresist and Cu hydrophilization, preventing oxidation, and enabling better plating solution penetration for fine patterns.