Process Solutions for SAW Device Manufacturing
SAMCO Inc. > Markets > Process Solutions for SAW Device Manufacturing
1. Electrode Formation (Metal Etching)
Aluminum Etching was performed using an ICP etch system.
The etched profile showed vertical sidewalls.
2. Photoresist Removal
Samco offers plasma cleaning systems and RIE systems for photoresist plasma ashing.
3. Substrate Trimming (IDT Fabrication)
LiNbO3 plasma etching was performed using an ICP etch system for fabrication of interdigital transducer (IDT), and smooth sidewalls were achieved. Other piezoelectric materials including quartz can be also processed for IDT fabrication.
4. Passivation Film Deposition
Samco’s cathode PECVD systems give advantages of high deposition uniformity for batch processing.
9 point measurement of 10 mm wafer edge for 3 x Ø4-inch wafers shows high wafer-to-wafer SiO2 deposition uniformity around ±1.5 %.
Aluminum electrodes were covered with a SiO2 passivation film without void.
5. Contact Hole Formation
State-of-the-art robots will improve process throughput with quick wafer transfer.
7. Dicing
8. Surface Cleaning before Wire Bonding
Samco’s bench-top plasma cleaners can process multiple wafers with additional shelves for surface cleaning.
