Scientific Paper on SU-8 Membrane Fabrication Using SiO2 Dry Etching by AIST, Japan

Scientific Paper on SU-8 Membrane Fabrication Using SiO₂ Dry Etching by AIST, Japan

February 22, 2015 February 22, 2015 Samco 2015 Customer, MEMS, Samco Customer Publication, Silicon/Dielectrics Etch, SiO2 Etch

Performance of SU-8 Membrane Suitable for Deep X-Ray Grayscale Lithography

Harutaka Mekaru
Research Center for Ubiquitous MEMS and Micro Engineering (UMEMSME), National Institute of
Advanced Industrial Science and Technology (AIST), 1-2-1 Namiki, Tsukuba, Ibaraki 305-8564, Japan
Micromachines 2015, 6, 252-265

Samco open-load Plasma Etching System (RIE etcher) was used for SiO₂ dry etching in the device fabrication. The SiO₂ layer was successfully removed without breaking the SU-8 membrane.

SiO2 Periodic Table

For our process capabilities of SiO₂ dry etching, please visit the page below.
SiO₂ Dry Etching Process (RIE or ICP-RIE)