Packaging and design of a heterogeneous dual laser chip for a widely tunable spectrally pure optical RF source
David W. Grund Jr., Garrett J. Schneider, Janusz Murakowski, and Dennis W. Prather
Electrical and Computer Engineering, University of Delaware, Newark, Delaware, USA
Optics Express (2014) 22, 17, pp. 19838-19849
Samco ICP Etch System was used for silicon fine etching.
Then, Samco PECVD System was used for SiO2 layer deposition to isolate a metal heater from the etched silicon layer.
For details of SiO2 PECVD process capabilities, please visit the page below.
SiO2 PECVD Process