Athermal Hybrid Silicon/Polymer Ring Resonator Electro-optic Modulator

Feng Qiu¹, Andrew M. Spring¹, Hiroki Miura², Daisuke Maeda³, Masa-aki Ozawa³, Keisuke Odoi³, and Shiyoshi Yokoyama^{1, 2
1} Institute for Materials Chemistry and Engineering, Kyushu University, 6-1 Kasuga-koen Kasuga-city, Fukuoka 816-8580, Japan
² Department of Molecular and Material Sciences, Kyushu University, 6-1 Kasuga-koen Kasuga-city, Fukuoka 816-8580, Japan
³ Nissan Chemical Industries, LTD, 2-10-1 Tuboi Nishi, Funabashi, Chiba 274-8507, Japan
ACS Photonics
DOI: 10.1021/acsphotonics.5b00695

Silicon plasma etching was performed using Samco silicon DRIE system to fabricate a hybrid silicon/polymer ring resonator electro-optic (EO) modulator.
For our process examples of silicon plasma etching, please visit process data page below.
Si Dry Etching Process (RIE, ICP-RIE or XeF₂ Etch)
Deep Silicon Trench/Via Hole Etching using Bosch Process
Si DRIE (Deep Reactive Ion Etching) for MEMS and TSV