300-nm Imperceptible, Ultraflexible, and Biocompatible e-Skin Fit with Tactile Sensors and Organic Transistors
Robert A. Nawrocki1, Naoji Matsuhisa1,2, Tomoyuki Yokota1 and Takao Someya1
1 Department of Electrical Engineering and Information Systems, School of Engineering, The University of Tokyo, Bunkyo-ku, Tokyo, Japan
2 Advanced Leading Graduate Course for Photon Science, Bunkyo-ku, Tokyo, Japan
Advanced Electronic Materials (2016)
Samco open-load RIE etcher was used for contact hole formation of encapsulation layers.