The RIE-600iP – SAMCO’s latest ICP etching solution designed specifically for SiC power devices fabrication – was recently honored with the “Semiconductor of the Year” award given by The Semiconductor Industry News. On June 5th, the award was presented at a ceremony at the JPCA Show 2013 (hosted by Tokyo Big Sight).

The concept of the “Semiconductor of the Year” award began in 1994 to promote the development of semiconductor technology within Japan. The RIE-600iP was selected as the winner based on new semiconductor products and technologies released between April 2012 and March 2013 and was evaluated for its originality in its design and performance, its current impact on the semiconductor industry and society, as well as its future potential. For these reasons, the RIE-600iP received the “Excellent Award” in the semiconductor equipment category.

For more details of ICP etching systems for SiC etching, please visit the page below.
ICP Etch Systems for High-power SiC Plasma Etching