Scientific paper on high-selectivity SiO2 etching by Fudan University
Highly selective etch of silicon dioxide with tungsten hard mask deposited by PVD process
Yuanhui Fang, Jian Zhang, Yu-Long Jiang
School of Microelectronics, Fudan University, Shanghai 200433, China
2018 18th International Workshop on Junction Technology (IWJT), Shanghai, 2018, pp. 1-3.
Samco RIE Plasma Etching Equipment was used for tungsten etching and SiO2 etching with the tungsten hardmask.