Fabrication of Vertically Aligned Diamond Whiskers from Highly Boron-Doped Diamond by Oxygen Plasma Etching
Chiaki Terashima1, Kazuki Arihara4, Sohei Okazaki4, Tetsuya Shichi4, Donald A. Tryk5, Tatsuru Shirafuji2, Nagahiro Saito1, 2, 3, Osamu Takai1, 2, 3, and Akira Fujishima4, 6
1 Research Center for Materials Backcasting Technology, Graduate School of Engineering, and 2Department of Materials, Physics and Energy Engineering, Graduate School of Engineering, 3 EcoTopia Science Institute, Nagoya University, Furo-cho, Chikusa-ku, Nagoya 464-8603, Japan
4 Technology Research and Development Department, General Technology Division, Central Japan Railway, 1545-33 Ohyama, Komaki City, Aichi 485-0801, Japan
5 Fuel Cell Nanomaterials Center, University of Yamanashi, 4-3-11 Takeda, Kofu, Yamanashi 400-8511, Japan
6 Tokyo University of Science, 1-3 Kagurazaka, Shinjyuku-ku, Tokyo 162-8601, Japan
ACS Appl. Mater. Interfaces, 2011, 3 (2), pp 177–182
DOI: 10.1021/am1007722
Samco open-load Plasma Etching System was used for diamond plasma etching to fabricate vertically aligned diamond whiskers.
For more details of our diamond plasma etching technologies, please visit the diamond process data page below.
Diamond Dry Etching Process (RIE or ICP-RIE)
