DNA combing on low-pressure oxygen plasma modified polysilsesquioxane substrates for single-molecule studies

K. K. Sriram^1,2,3 Chun-Ling Chang³ U. Rajesh Kumar^1,4,5 and Chia-Fu Chou^3,6,7
1 Nano Science and Technology Program, Taiwan International Graduate Program, Academia Sinica, Taipei 11529, Taiwan
² Department of Engineering and System Science, National Tsing Hua University, Hsinchu 30013, Taiwan
³ Institute of Physics, Academia Sinica, Taipei 11529, Taiwan
⁴ Institute of Atomic and Molecular Sciences, Academia Sinica, Taipei 10617, Taiwan
⁵ Department of Chemistry, National Taiwan University, Taipei 10617, Taiwan
⁶ Genomics Research Center, Academia Sinica, Taipei 11529, Taiwan
⁷ Research Center for Applied Sciences, Academia Sinica, Taipei 11529, Taiwan
Biomicrofluidics (2014) 8, 052102

SAMCO ICP Etch System was used for microchannel fabrication on fused silica glass substrates.

For more details of our glass dry etch technologies (SiO2, fused silica and quartz), please visit the page below.
SiO₂ Dry Etching Process (RIE or ICP-RIE)

Structural Optimization of Metallic Infrared Filters Based on Extraordinary Optical Transmission

Makoto Ohkado¹, Tsuyoshi Nomura¹, Atushi Miura¹, Hisayoshi Fujikawa¹, Naoki Ikeda², Yoshimasa Sugimoto² and Shinji Nishiwaki^3
1Toyota Central R&D Labs. Inc., 41-1 Yokomichi, Nagakute, Aichi 480-1192, Japan
²National Institute for Material Science, 1-2-1 Sengen, Tsukuba, Ibaraki 305-0047, Japan
³Kyoto University, Yoshida Honmachi, Sakyo-ku, Kyoto, Kyoto 606-8501, Japan
Transactions of the Materials Research Society of Japan (2013) 38, No. 2 p. 167-170

SiO₂ plasma etching and Al plasma etching were performed using Samco RIE system and ICP etch system, respectively to fabricate hole array structures of the infrared filter.

For more details of our SiO₂ dry etching capabilities, please visit the page below.
SiO₂ Dry Etching Process (RIE or ICP-RIE)

A transfer technique of stress sensors for versatile applications

C. Dou, H. Yang, Y. Wu and X. Li
State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, China
Nano/Micro Engineered and Molecular Systems (NEMS), 2013 8th IEEE International Conference on, Suzhou, 2013, pp. 931-934.
doi: 10.1109/NEMS.2013.6559876

Samco open-load RIE etch system was used for SiO₂ layer removal in device fabrication.

For more details of our SiO₂ plasma etching capabilities, please visit the page below.
SiO₂ Dry Etching Process (RIE or ICP-RIE)