Bulk vertical micromachining of single-crystal sapphire using inductively coupled plasma etching for x-ray resonant cavities

P-C Chen¹, P-T Lin¹, D G Mikolas¹, Y-W Tsai², Y-L Wang¹, C-C Fu¹ and S-L Chang^2
1 Institute of Nano Engineering and Microsystems, National Tsing-Hua University, No. 101, Kuang-fu Rd, Sec. II, Hsinchu 300, Taiwan
² Department of Physics, National Tsing-Hua University, No. 101, Kuang-fu Rd, Sec. II, Hsinchu 300, Taiwan
J. Micromech. Microeng. (2015) 25 015016

Samco ICP Etching System was used for the recipe optimization of sapphire plasma etching in x-ray resonant cavity fabrication.

For our process capabilities of sapphire plasma etching, please visit the page below.
Sapphire Dry Etching Process (ICP-RIE)

Angled etching of (001) rutile Nb–TiO₂ substrate using SF₆-based capacitively coupled plasma reactive ion etching

Akihiro Matsutani¹, Kunio Nishioka¹, Mina Sato¹, Dai Shoji¹, Daito Kobayashi², Toshihiro Isobe², Akira Nakajima², Tetsu Tatsuma³ and Sachiko Matsushita^2
1 Semiconductor and MEMS Processing Center, Tokyo Institute of Technology, Yokohama 226-8503, Japan
² Department of Metallurgy and Ceramics Science, Tokyo Institute of Technology, Meguro, Tokyo 152-8550, Japan
³ Institute of Industrial Science, The University of Tokyo, Meguro, Tokyo 153-8505, Japan
Jpn. J. Appl. Phys. (2014) 53 06JF02

Rutile Nb–TiO₂ substrates were etched using Samco Reactive Ion Etch (RIE) System. Vertical sidewalls and a smooth surface were successfully achieved.

High-aspect-ratio nanoimprinted structures for a multi-pole magnetic scale

Zhi-Hao Xu¹, Chien-Li¹, Cheng-Kuo¹, Sheng-Ching³ and Tsung-Shune Chin^2
1 Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu 30013, TAIWAN
² Department of Materials Science & Engineering, Feng Chia University, Taichung 40724, TAIWAN
³ Department of Mechanical Engineering, National United University, Miaoli 36003, TAIWAN
Microsystem Technologies (2014) 20, 10, pp 1949-1953

SAMCO Plasma Cleaner was used for photoresist stripping/trimming in high-aspect-ratio structure.

For more details of our photoresist stripping & removal process solutions, please visit the page below.
Plasma Ashing & Stripping of Photoresist

Structural Optimization of Metallic Infrared Filters Based on Extraordinary Optical Transmission

Makoto Ohkado¹, Tsuyoshi Nomura¹, Atushi Miura¹, Hisayoshi Fujikawa¹, Naoki Ikeda², Yoshimasa Sugimoto² and Shinji Nishiwaki^3
1Toyota Central R&D Labs. Inc., 41-1 Yokomichi, Nagakute, Aichi 480-1192, Japan
²National Institute for Material Science, 1-2-1 Sengen, Tsukuba, Ibaraki 305-0047, Japan
³Kyoto University, Yoshida Honmachi, Sakyo-ku, Kyoto, Kyoto 606-8501, Japan
Transactions of the Materials Research Society of Japan (2013) 38, No. 2 p. 167-170

SiO₂ plasma etching and Al plasma etching were performed using Samco RIE system and ICP etch system, respectively to fabricate hole array structures of the infrared filter.

For more details of our SiO₂ dry etching capabilities, please visit the page below.
SiO₂ Dry Etching Process (RIE or ICP-RIE)

Optimization of graphene dry etching conditions via combined microscopic and spectroscopic analysis

Mariana C. Prado¹, Deep Jariwala², Tobin J. Marks^2,3 and Mark C. Hersam^2,3
1 Departamento de Física, Universidade Federal de Minas Gerais, Av. Antônio Carlos, 6627, 31270-901 Belo Horizonte, Brazil
² Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA
³ Department of Chemistry, Northwestern University, Evanston, Illinois 60208, USA
Appl. Phys. Lett. (2013) 102, 193111

Samco RIE System at Northwestern University was used for investigation of reactive ion etching process of graphene.

Samco RIE systems are versatile tools for plasma etching of various materials including Si, SiO₂, SiN_x, metal, polymer and carbon-based materials.
For more information on our RIE system, please visit the product page below.
RIE Etching Systems

Monolithic integration of Pb(Zr,Ti)O3 thin film based resonators using a complete dry microfabrication process

Yonggang Jiang¹ , Kensuke Kanda^2,3, Yuki Iga², Takayuki Fujita^2,3, Kohei Higuchi², Kazusuke Maenaka^2,3
1 School of Mechanical Engineering and Automation, Beihang University, Xueyuan Road No. 37, Haidian District, Beijing, 100191, China
² Maenaka Human-Sensing Fusion Project, ERATO, Japan Science and Technology Agency, 2167 Shosha, Himeji, Hyogo, 671-2280, Japan
³ Graduate School of Engineering, University of Hyogo, 2167 Shosha, Himeji, Hyogo, 671-2280, Japan
Microsyst Technol (2013) 19:137–142

SAMCO ICP etch system was used for PZT plasma etching to fabricate thin film MEMS resonators.

Crack-free controlled wrinkling of a bilayer film with a gradient interface

Yan Xuan^a Xu Guo^a Yushuang Cui^a Changsheng Yuan^a Haixiong Ge^a Bo Cui^b and Yanfeng Chen^a
a National Laboratory of Solid State Microstructures, Department of Materials Science and Engineering, College of Engineering and Applied Sciences, Nanjing University, Nanjing, 210093, China
^b Department of Electrical and Computer Engineering, University of Waterloo, 200 University Avenue, West Waterloo, Ontario N2L3G1, Canada
Soft Matter (2012) 8, 9603

SAMCO Plasma Etching System (RIE etcher) was used for plasma etching of silicon-containing resist and PMMA to fabricate wrinkled films.

High-Q AlN photonic crystal nanobeam cavities fabricated by layer transfer

S. Sergent¹, M. Arita¹, S. Kako¹, K. Tanabe¹, S. Iwamoto^1,2 and Y. Arakawa^1,2
1 Institute for Nano Quantum Information Electronics, The University of Tokyo, 4-6-1 Komaba, Meguro, Tokyo 153-8505, Japan
² Institute of Industrial Science, The University of Tokyo, 4-6-1 Komaba, Meguro, Tokyo 153-8505, Japan
Appl. Phys. Lett. 101, 101106 (2012)

AlN nanopattern was fabricated by AlN plasma etching using Samco ICP etch system to improve the quality factor of nanobeam cavities.

For more information on our ICP etching sytems, please visit the product page below.
Samco ICP Plasma Etcher

Fabrication of Vertically Aligned Diamond Whiskers from Highly Boron-Doped Diamond by Oxygen Plasma Etching

Chiaki Terashima¹, Kazuki Arihara⁴, Sohei Okazaki⁴, Tetsuya Shichi⁴, Donald A. Tryk⁵, Tatsuru Shirafuji², Nagahiro Saito^{1, 2, 3}, Osamu Takai^{1, 2, 3}, and Akira Fujishima^{4, 6
1} Research Center for Materials Backcasting Technology, Graduate School of Engineering, and ²Department of Materials, Physics and Energy Engineering, Graduate School of Engineering, ³ EcoTopia Science Institute, Nagoya University, Furo-cho, Chikusa-ku, Nagoya 464-8603, Japan
⁴ Technology Research and Development Department, General Technology Division, Central Japan Railway, 1545-33 Ohyama, Komaki City, Aichi 485-0801, Japan
⁵ Fuel Cell Nanomaterials Center, University of Yamanashi, 4-3-11 Takeda, Kofu, Yamanashi 400-8511, Japan
⁶ Tokyo University of Science, 1-3 Kagurazaka, Shinjyuku-ku, Tokyo 162-8601, Japan
ACS Appl. Mater. Interfaces, 2011, 3 (2), pp 177–182
DOI: 10.1021/am1007722

Samco open-load Plasma Etching System was used for diamond plasma etching to fabricate vertically aligned diamond whiskers.

For more details of our diamond plasma etching technologies, please visit the diamond process data page below.
Diamond Dry Etching Process (RIE or ICP-RIE)

Reactive Ion Etching of β-FeSi₂ with Inductively Coupled Plasma

Takayuki Wakayama, Takashi Suemasu, Tomomi Kanazawa and Hiroyuki Akinaga
Institute of Applied Physics, University of Tsukuba, Tsukuba, Ibaraki 305-8573, Japan
Jpn. J. Appl. Phys. (2006) 45 L569

Samco ICP-RIE etcher was used for plasma etch recipe development of β-FeSi₂ on a silicon substrate using fluorine chemistry.
High etch selectivity of β-FeSi₂ against silicon was investigated.

Please visit our product page for more details of our ICP plasma etch systems.
ICP Plasma Etch Systems for Si, SiO₂, III-V & Metal