A Low Temperature Processed, Soft-fluidic OEGFET Saliva Aptasensor for Cortisol

Roslyn S. Massey and Ravi Prakash
Department of Electronics Engineering, Carleton University, Ottawa, ON K1S 5B6, Canada;
IEEE Journal on Flexible Electronics, 1 – 1, 2022

Samco UV-Ozone cleaner UV-1 was used for PMMA surface treatment in biosensor fabrication.

Celluloid Microenclosure and Microlens Array Fabricated by Suzukiʼs Universal Microprinting Method and XeF₂ Vapor Etching for Microbial Analysis

Akihiro Matsutani¹ and Ayako Takada^2
1 Semiconductor and MEMS Processing Division, Technical Department, Tokyo Institute of Technology,
4259 Nagatsuta, Yokohama, Kanagawa 226-8503, Japan
² Biomaterials Analysis Division, Technical Department, Tokyo Institute of Technology,
4259 Nagatsuta, Yokohama, Kanagawa 226-8501, Japan
Sensors and Materials, Vol. 30, No. 1 (2018) 149–155

A celluloid-based biochip for cell trapping is fabricated using Suzuki’s universal microprinting (SUMP) method. Samco tabletop Reactive Ion Etching (RIE) system was used for mold fabrication. Si layer was etched over photoresist and Cr mask in fluorine chemistry.

For more information on our RIE system lineup, please visit the product page below.
RIE Systems

Fabrication of 25 μm-filter microfluidic chip on silicon substrate

Nguyen Ngan Le^1,2, Kim Khanh Huynh¹, Thi Cam Hue Phan¹, Thi My Dung Dang¹ and Mau Chien Dang^1
1 Laboratory for Nanotechnology, Vietnam National University in Ho Chi Minh City, Community 6, Linh
Trung Ward, Thu Duc District, Ho Chi Minh, Vietnam
² University of Science, Vietnam National University in Ho Chi Minh City, 227 Nguyen Van Cu Street,
District 5, Ho Chi Minh City, Vietnam
Adv. Nat. Sci.: Nanosci. Nanotechnol. 8 (2017) 015003

A microfluidic chip device was fabricated using deep silicon etching technology of the Bosch Process. Samco Deep RIE Tool RIE-200iPB was used for silicon etching over silver hard mask. With optimization of process recipe in the silicon etching, vertical silicon channel profile was fabricated.

For more details of our deep RIE process capabilities, please visit the pages below.
Silicon DRIE (Deep Reactive Ion Etching) for MEMS and TSV
Deep Silicon Trench/Via Hole/Pillar Etching using the Bosch Process

Wettability control on multiphase flow in patterned microfluidics

Benzhong Zhao^a, Christopher W. MacMinn^b, and Ruben Juanes^a
a Department of Civil and Environmental Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139;
^b Department of Engineering Science, University of Oxford, Oxford OX1 3PJ, United Kingdom
PNAS (2016) DOI10.1073/pnas.1603387113

Fluid–fluid displacement in porous media of microfluidic flow cell was studied for potential CO₂ sequestration application to solve global warming caused by the greenhouse gas.
Samco tabletop UV-ozone cleaner at MIT was used for wettability improvement of photocurable polymer NOA81 to fabricate microfluidic flow cells.

This article was featured in MIT News.
View the news article.

Integrated solid-state nanopore platform for nanopore fabrication via dielectric breakdown, DNAspeed deceleration and noise reduction

Yusuke Goto, Itaru Yanagi, Kazuma Matsui, Takahide Yokoi & Ken-ichi Takeda
Center for Technology Innovation – Healthcare, Research & Development Group, Hitachi Ltd.,1-280 Higashi-Koigakubo, Kokubunji, Tokyo 185-8601, Japan.
Scientific Reports 6, Article number: 31324 (2016) doi:10.1038/srep31324

Samco plasma cleaner was used for surface cleaning and wettability modulation of substrates with Si₃N₄ membranes in sample preparation.

Multiplexed immunosensing and kinetics monitoring in nanofluidic devices with highly enhanced target capture efficiency

Yii-Lih Lin^1,2,3, Yen-Jun Huang^3,4, Pattamon Teerapanich^5,6, Thierry Leïchlé^5,6 and Chia-Fu Chou^2,3
1 Department of Chemistry, National Taiwan University, Taipei, Taiwan
² Nano Science and Technology Program, Taiwan International Graduate Program, Academia Sinica and National Taiwan University, Taipei, Taiwan
³ Institute of Physics, Academia Sinica, Taipei, Taiwan
⁴ Department of Physics, National Taiwan University, Taipei, Taiwan
⁵ LAAS-CNRS, 7 Avenue du Colonel Roche, F-31077 Toulouse, France
⁶ Université de Toulouse, F-31077 Toulouse, France
Biomicrofluidics 10, 034114 (2016)

Samco ICP etch system, RIE-10iP was used for nano-slit pattern fabrication by fused quartz plasma etching.

For our process capabilities of SiO₂ and quartz plasma etching, please visit the process data page below.
SiO₂ Dry Etching Process (RIE or ICP-RIE)

Top-Down Nanofabrication and Characterization of 20 nm Silicon Nanowires for Biosensing Applications

M. Nuzaihan M. N ¹, U. Hashim^1,2, M. K. Md Arshad^1,2, A. Rahim Ruslinda¹, S.F.A. Rahman³, M. F. M. Fathil¹, Mohd. H. Ismail^2
1 Institute of Nano Electronic Engineering, Universiti Malaysia Perlis, 01000 Kangar, Perlis, Malaysia,
² School of Microelectronic Engineering, Universiti Malaysia Perlis (UniMAP), 02600 Pauh, Perlis, Malaysia,
³ Chemistry Department, Faculty of Science, Universiti Putra Malaysia, 43400 UPM Serdang, Selangor, Malaysia
PLoS ONE 11(3): e0152318. doi:10.1371/journal.pone.0152318

Samco ICP etch system at Universiti Malaysia Perlis was used for anisotropic etching of silicon for silicon nanowires fabrication.
For our process examples of silicon dry etching, please visit the process data page below.
Si Dry Etching Process (RIE, ICP-RIE or XeF₂ Etch)

Microfluidic chips for forward blood typing performed with a multichannel waveguide-mode sensor

Hiroki Ashiba^a, Makoto Fujimaki^a, Koichi Awazuv, Torahiko Tanaka^b and Makoto Makishima^b
a Electronics and Photonic Research Institute, National Institute of Advanced Industrial Science and Technology (AIST), 1-1-1 Higashi, Tsukuba, Ibaraki 305-8565, Japan
^b Division of Biochemistry, Department of Biomedical Sciences, Nihon University School of Medicine, 30-1 Oyaguchi-kamicho, Itabashi, Tokyo 173-8610, Japan
Sensing and Bio-Sensing Research 2016 Volume 7, March 2016, Pages 121-126

Samco ICP etcher was used to fabricate a mold template of microfluidic chips by silicon plasma etching.

For our process capabilities of silicon plasma etching, please visit the process data page below.
Si Dry Etching Process (RIE, ICP-RIE or XeF₂ Etch)

Enhancement of microfluidic particle separation using cross-flow filters with hydrodynamic focusing

Yun-Yen Chiu, Chen-Kang Huang, and Yen-Wen Lu
Department of Bio-Industrial Mechatronics Engineering, National Taiwan University, Taipei 10617, Taiwan, Republic of China
Biomicrofluidics (2016) 10, 011906

Samco silicon DRIE system at National Taiwan University was used for microchannel fabrication with crossflow filtration mechanism.

For more details of our deep silicon etching capabilities, please visit the process data pages below.
Deep Silicon Trench/Via Hole Etching using Bosch Process
Si DRIE (Deep Reactive Ion Etching) for MEMS and TSV

Microfluidic chemical processing with on-chip washing by deterministic lateral displacement arrays with separator walls

Yu Chen^1,2, Joseph D’Silva^1,2, Robert H. Austin^1,3 and James C. Sturm^1,2
1 Princeton Institute for Science and Technology of Materials (PRISM), Princeton, New Jersey 08544, USA
² Department of Electrical Engineering, Princeton University, Princeton, New Jersey 08544, USA
³ Department of Physics, Princeton University, Princeton, New Jersey 08544, USA
BIOMICROFLUIDICS 9, 054105 (2015)

Samco Silicon DRIE System at Princeton University was used for microchannel fabrication.

For our process capabilities of deep silicon etching, please visit the pages below.
Si DRIE (Deep Reactive Ion Etching) for MEMS and TSV
Deep Silicon Trench/Via Hole Etching using Bosch Process