Category: 2017 Events
Visit us at SEMICON Europa 2017
When: November 14 – 17, 2017
Where: Messe München Munich, Germany
Booth: B1-412
Visit Samco at SEMICON Europa 2017, which will be held at Messe München Munich, Germany.
This year we will focus on these topics with new booth design.
· SiC/GaN plasma etching technology for next-generation power devices
· III-V (InP/GaAs/GaN) and silicon plasma etching technology for laser diodes
· Silicon Deep RIE technology for MEMS device fabrication
If you’re interested in meeting with us, contact us to make an appointment.
Visit Samco’s Booth at SEMICON Taiwan 2017
When: September 13 – 15, 2017
Where: Taipei Nangnag Exhibition Center, Taipei, Taiwan
Booth: 338 (→Floor Map)
Visit Samco at SEMICON Taiwan 2017, which will be held at the Taipei Nangnag Exhibition Center in Taipei, Taiwan.
Samco joins Taiwan’s largest microelectronics trade show every year to communicate with customers who are looking for advanced processing technology for microelectronics manufacturing. This year we will focus on process solutions for MEMS, TSV, Plasma Dicing, FOWLP (Fan Out Wafer Level Package) and Failure Analysis.
If you’re interested in meeting with us, contact us to make an appointment.
Samco SiC Power Device Seminar in Shanghai, China will be held on March 13 2017
Samco SiC Power Device Seminar in Shanghai, China
Day: March 13, 2017
Venue: Fudan University Yifu Hall
Registration Fee: Free
Speakers:
● “New Materials and Different Field Technologies are Expanding the Semiconductor World” – key note speech –
Hidemi Takasu
ROHM Co., Ltd. Colleague (former managing director)& Tsinghua University Guest Professor
● “Advances in SiC Epitaxy and Devices”
Dr.Feng Zhang
Global Power Technology Co., Ltd. CTO
● “Introduction of Samco”
Jianhui Zhou
Samco Inc. Shanghai Office
● “Application Issues and Packaging for Wide Band Gap Devices”
Prof.Xu Yang
Xi’an Jiaotong University
● “Introduction of Advanced SiC Etching Process and Dry Etching System”
Chikashi Oshige
Samco Inc. R&D division
● “Nanofabrication and its Applications in Basic Scientific Study”
Prof.Yifang Chen
Fudan University
This seminar’s main theme is “Process Technology and Applications of New Generation SiC Power Devices”.
Samco provides SiC plasma etching systems and processes to industry customers for SiC trench MOSFET fabrication.
SiC Power Device Seminar Flyer (PDF) >>
If you are interested in attending this seminar, please proceed to the registration form below.
Seminar Registration Form >>
Samco MEMS Workshop in New Delhi, India will be held on March 8 2017
Samco MEMS Workshop 2017 in New Delhi, India
Day: March 8, 2017
Venue: Lecture Hall Complex, IIT Delhi
Speakers:
- Prof. Hiroshi Toshiyoshi, University of Tokyo, Japan
– “MEMS for Optics, Microwave and Energy Harvester Applications” - Prof. V. Ramgopal Rao, IIT Delhi
– “Polymer MEMS: Opportunities and Challenges” - Dr. Surinder Singh, Semi-Conductor Laboratory
– “MEMS Sensors for Space Applications” - Prof. Rudra Pratap, CeNSE, IISc
– “Dynamic MEMS Sensors” - Tomoyuki Nanoka, Samco Inc.
– “Samco Si-DRIE System Introduction”
This workshop aims at providing a broad overview on MEMS & NEMS plasma applications which are fundamental techniques for nanofabrication in R&D. Samco held its first MEMS workshop at IIT Bombay in February 2016, and this is the second workshop in India.
MEMS Workshop Flyer (PDF) >>
If you are interested in attending this workshop, please proceed to the registration form below.
Workshop Registration Form >>
Meet us at MEMS 2017
Samco holds a booth at MEMS 2017 conference at Las Vegas, USA.
Date : January 22 – 26, 2017
Location : Rio Las Vegas Hotel and Casino, Las Vegas, US
Booth : 5
We will show our latest updates on MEMS device processing technologies.
· Deep silicon etching (the Bosch process) for MEMS structure fabrication
· Fine and nano-scale dry etching technologies (RIE and ICP-RIE) of various materials
– silicon, SiO2, III-V, metals, polymers and other materials
· PECVD technologies (SiO2 and SiNx) for hark mask fabrication
· Plasma cleaners and UV-ozone cleaners for photoresist ashing, surface cleaning and modification
· XeF2 etching system for reliable dry release of MEMS structure
If you are interested in discussion on our process technologies and capabilities, please visit our booth (No. 5).
Go to MEMS 2017 website