Process Solutions for MEMS Device Manufacturing
SAMCO Inc. > Markets > Process Solutions for MEMS Device Manufacturing
1. Deep Silicon Etching by the Bosch Process
Insulating layers of SOI substrates are widely used for a silicon etch stop in MEMS device fabrication. Samco has developed a unique notch-free SOI etching process that maintains the etch selectivity by using superimposed Radio Frequency (RF) power. Furthermore, The deep silicon etching processes are performed without tilt across ø6″ or 8″ wafers.
2. Photoresist Plasma Ashing
Samco plasma cleaners are suitable for photoresist plasma ashing in MEMS device fabrication. For high-volume production, RIE etching systems with atmospheric double cassettes will enhance throughput.
3. SiO2 Sacrificial Layer Removal
4. Surface Cleaning before Packaging
Samco plasma cleaners provide process solutions of surface cleaning before packaging. For processing of materials which are sensitive to physical damage by ion bombardment and charging, UV-Ozone cleaners would be an option.
