Plasma Cleaners
Samco plasma cleaners are versatile plasma cleaning tools to remove contamination from the surface of samples such as plastic packages, wafers and glass slides in sample preparation and device fabrication. Our systems also can be used for photoresist ashing, ink removal, surface activation and wettability improvement.
The PC-300 and PC-1100 are plasma cleaning systems using parallel-plate direct plasma. They are fully automatic systems with a touch panel. The process chamber enables the user to install multiple sample shelves, and the high degree of flexibility in configuration supports batch processing of a wide degree of products from small electronic components to larger substrates. Furthermore, the systems can be configured in three different processing modes that enable the user to select the optimum processing environment.
Process Examples
Plasma Surface Modification of Various Materials
SAMCO plasma cleaners are suitable for plasma surface modification. Various materials such as silicon, glass, metals and polymers can be processed for wettability control. Polymethyl methacrylate (PMMA) samples were processed using a plasma cleaner and characterized with water contact angle. The samples showed hydrophilic surface after the plasma processing. This surface modification process enhances adhesion of materials, and some customers use this process for bonding of samples in microfluidic device fabrication. Typical material combination of this application is Polydimethyl siloxane (PDMS) and glass. Easy-to-use touch screen of our plasma cleaners enables one-button operation for plasma surface activation of the materials.
Do you need plasma treatment of non-flat samples? We’ve got you covered!
We offer plasma cleaning process solutions for inner-walls of 3D structures such as plastic and glass tubes.
Initial PMMA
Contact Angle : 76.8°
PMMA after Plasma Surface Modification
Contact Angle : 20.2°
Specification Chart
| Tabletop Plasma Cleaners | |
| Loading | Manual Load |
| Sample Size | 320 mm x 230 mm
405 mm x 410 mm (powered) 350 mm x 425 mm (grounded) |
| Gases | Up to 3 gas lines |
| Plasma Mode | Three Plasma Processing Modes |
| RF Power | 600/1000 W |
| System Control | Easy-to-use Touch-panel GUI |
| System Features |
Multiple shelves for batch processing |
| Applications |
Surface cleaning of plastic packages and lead-frames Precision cleaning of optical components and molds Surface cleaning of organic films Photoresist ashing & descum Removal of organic contaminants |
System Features
Three plasma processing modes
SAMCO’s bench-top plasma cleaners are equipped with three different modes depending on shelf position settings.
Reactive Ion Etching (RIE) Mode
Samples are placed on the powered electrode. Ions induced by RF power directly attacks the substrate, and they will increase the etch rate.
Plasma Etching (PE) Mode
Samples are placed on grounded electrode. While ions do not attack the substrate, radicals react with the surface. This configuration eliminates the risks of plasma damage caused by ion bombardment.
Downstream Mode
A perforated electrode is placed above samples to isolate them from the plasma and minimize plasma damage.
Multiple Shelves
Multiple shelves allow for increased throughput
Testimonial
SAMCO plasma cleaners are used for device fabrication and material processing at nanofabrication facilities including
National Tsing Hua University
